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INTEGRATED CIRCUITS
DATA SHEET
UAA3201T UHF/VHF remote control receiver
Product specification Supersedes data of 1995 May 18 File under Integrated Circuits, IC18 2000 Apr 18
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
FEATURES * Oscillator with external Surface Acoustic Wave Resonator (SAWR) * Wide frequency range from 150 to 450 MHz * High sensitivity * Low power consumption * Automotive temperature range * Superheterodyne architecture * Applicable to fulfil FTZ 17 TR 2100 (Germany) * High integration level, few external components * Inexpensive external components * IF filter bandwidth determined by application. QUICK REFERENCE DATA SYMBOL VCC ICC Pref PARAMETER supply voltage supply current input reference sensitivity fi(RF) = 433.92 MHz; data rate = 250 bits/s; BER 3 x 10-2 CONDITIONS MIN. 3.5 - - APPLICATIONS * Car alarm systems * Remote control systems * Security systems * Gadgets and toys * Telemetry. GENERAL DESCRIPTION
UAA3201T
The UAA3201T is a fully integrated single-chip receiver, primarily intended for use in VHF and UHF systems employing direct AM Return-to-Zero (RZ) Amplitude Shift Keying (ASK) modulation.
TYP. - 3.4 -
MAX. 6.0 4.8 -105
UNIT V mA dBm
Tamb
ambient temperature
-40
-
+85
C
ORDERING INFORMATION TYPE NUMBER UAA3201T PACKAGE NAME SO16 DESCRIPTION plastic small outline package; 16 leads; body width 3.9 mm VERSION SOT109-1
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
BLOCK DIAGRAM
UAA3201T
handbook, full pagewidth
RF_IN
IF FILTER C19
VCC C12 C17 LFB 12 CPC 11 R1 CPO 10
VEM 15
MIXIN 14
FA 16 IF AMPLIFIER
LIN 13
MIXER LIMITER BUFFER VCC BAND GAP REFERENCE Vref
x
BUFFER COMPARATOR 9 DATA data
UAA3201T
OSCILLATOR 4 OSC 5 OSE 1 MON 2
3 VCC
6 VEE
7 CPB C14
8 CPA C13
MHB679
MOP
C7
Fig.1 Block diagram.
PINNING SYMBOL MON MOP VCC OSC OSE VEE CPB CPA DATA CPO CPC LFB LIN MIXIN VEM FA PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION negative mixer output positive mixer output positive supply voltage oscillator collector oscillator emitter negative supply voltage comparator input B comparator input A data output comparator offset adjustment comparator input C limiter feedback limiter input mixer input negative supply voltage for mixer IF amplifier output Fig.2 Pin configuration.
MON MOP VCC OSC OSE VEE CPB CPA 1 2 3 4 16 FA 15 VEM 14 MIXIN 13 LIN
UAA3201T
5 6 7 8
MED897
12 LFB 11 CPC 10 CPO 9 DATA
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
FUNCTIONAL DESCRIPTION The RF signal is fed directly into the mixer stage where it is mixed down to nominal 500 kHz IF by the integrated oscillator controlled by an external SAWR (see Fig.1). The IF signal is then passed to the IF amplifier which increases the level. A 5th-order elliptic low-pass filter acts as main IF filtering. The output voltage of that filter is demodulated by a limiter that rectifies the incoming IF signal. The demodulated signal passes two RC filter stages and is then limited by a data comparator which makes it available at the data output. Mixer The mixer is a single balanced emitter coupled pair with internally set bias current. The optimum impedance is 320 at 430 MHz. Capacitor C5 (see Fig.9) is used to transform a 50 generator impedance to the optimum value. Oscillator The oscillator consists of a transistor in common base configuration and a tank circuit including the SAWR. Resistor R2 (see Fig.9) is used to control the bias current through the transistor. Resistor R3 is required to reduce unwanted responses of the tank circuit. IF amplifier The IF amplifier is a differential input, single-ended output emitter coupled pair. It is used to decouple the first and the second IF filter and to provide some additional gain in order to reduce the influence of the noise of the limiter on the total noise figure. IF filters The first IF filter is an RC filter formed by internal resistors and an external capacitor C7 (see Fig.1). The second IF filter is an external elliptic filter. The source impedance is 1.4 k and the load is high-impedance. The bandwidth of the IF filter in the application and test circuit (see Fig.9) is 800 kHz due to the centre frequency spread of the SAWR. It may be reduced when SAWRs with less tolerances are used or temperature range requirements are lower. A smaller bandwidth of the filter will yield a higher sensitivity of the receiver. As the RF signal is mixed down to a low IF signal there is no image rejection possible. Band gap reference Limiter
UAA3201T
The limiting amplifier consists of three DC coupled amplifier stages with a total gain of 60 dB. A Received Signal Strength Indicator (RSSI) signal is generated by rectifying the IF signal. The limiter has a lower frequency limit of 100 kHz which can be controlled by capacitors C12 and C19. The upper frequency limit is 3 MHz. Comparator The 2 x IF component in the RSSI signal is removed by the first order low-pass capacitor C17. After passing a buffer stage the signal is split into two paths, leading via RC filters to the inputs of a voltage comparator. The time constant of one path (C14) is compared to the bit duration. Consequently the potential at the negative comparator input represents the average magnitude of the RSSI signal. The second path with a short time constant (C13) allows the signal at the positive comparator input to follow the RSSI signal instantaneously. This results in a variable comparator threshold, depending on the strength of the incoming signal. Hence the comparator output is switched on, when the RSSI signal exceeds its average value, i.e. when an ASK `on' signal is received. The low-pass filter capacitor C13 rejects the unwanted 2 x IF component and reduces the noise bandwidth of the data filter. The resistor R1 is used to set the current of an internal source. This current is drawn from the positive comparator input, thereby applying an offset and driving the output into the `off' state during the absence of an input signal. This offset can be increased by lowering the value of R1 yielding a higher noise immunity at the expense of reduced sensitivity.
The band gap reference controls the biasing of the whole circuit. In this block currents are generated that are constant over the temperature range and currents that are proportional to the absolute temperature. The current consumption of the receiver rises with increasing temperature, because the blocks with the highest current consumption are biased by currents that are proportional to the absolute temperature.
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCC Tamb Tstg Ves supply voltage ambient temperature storage temperature electrostatic handling voltage pins OSC and OSE pins LFB and MIXIN all other pins Note note 1 -2000 -1500 -2000 PARAMETER CONDITIONS MIN. -0.3 -40 -55
UAA3201T
MAX. +8.0 +85 +125 +1500 +2000 +2000 V
UNIT C C V V V
1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 105 UNIT K/W
DC CHARACTERISTICS VCC = 3.5 V; all voltages referenced to VEE; Tamb = -40 to +85 C; typical value for Tamb = 25 C; for test circuit see Fig.9; SAWR disconnected; unless otherwise specified. SYMBOL VCC ICC VOH(DATA) VOL(DATA) Note 1. IDATA is defined to be positive when the current flows into pin DATA. PARAMETER supply voltage supply current HIGH-level output voltage at pin DATA LOW-level output voltage at pin DATA R2 = 680 IDATA = -10 A; note 1 IDATA = +200 A; note 1 CONDITIONS - MIN. 3.5 - 3.4 TYP. MAX. 6.0 4.8 VCC 0.6 V mA V V UNIT
VCC - 0.5 - 0 -
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
AC CHARACTERISTICS VCC = 3.5 V; Tamb = 25 C; for test circuit see Fig.9; R1 disconnected; for AC test conditions see Section "AC test conditions"; unless otherwise specified. SYMBOL Pref Pi(max) Pspur IP3mix IP3IF P1dB ton(RX) Notes 1. Pref is the maximum available power at the input of the test board. The Bit Error Rate (BER) is measured using the test facility shown in Fig.8. 2. Valid only for the reference PCB (see Figs 10 and 11). Spurious radiation is strongly dependent on the PCB layout. 3. The supply voltage VCC is pulsed as explained in Fig.3. INTERNAL PIN CONFIGURATION PIN 1 2 SYMBOL MON MOP
1.5 k 1 1.5 k
PARAMETER input reference sensitivity maximum input power spurious radiation interception point (mixer) interception point (mixer plus IF amplifier) 1 dB compression point (mixer) receiver turn-on time
CONDITIONS BER 3 x 10-2; note 1 BER 3 x note 2 10-2
MIN. - - - -20 -38 -38
TYP. - - - -17 -35 -35 -
MAX. -105 -30 -60 - - - 10
UNIT dBm dBm dBm dBm dBm dBm ms
note 3
-
EQUIVALENT CIRCUIT
VP
from oscillator buffer
2
MHB680
3
VCC
3 VCC
MHB681
4 5
OSC OSE
4
VP
5 6 k 1.2 V
MHB682
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
PIN 6
SYMBOL VEE
EQUIVALENT CIRCUIT
6
MHB683
7 8
CPB CPA
VP 150 k
7 150 k 8
MHB684
9
DATA
VP
1 k 9
MHB686
10
CPO
VP
10
MHB685
11
CPC
VP
30 k
11
MHB704
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
PIN 12 13
SYMBOL LFB LIN
EQUIVALENT CIRCUIT
VP 50 k 12 13
MHB687
14 15
MXIN VEM
14
15
MHB688
16
FA
VP
1.4 k 16
MHB689
TEST INFORMATION Tuning procedure for AC tests 1. Turn on the signal generator: fi(RF) = 433.92 MHz, no modulation and RF input level = 1 mV. 2. Tune capacitor C6 (RF stage input) to obtain a maximum voltage on pin LIN. 3. Check that data is appearing on pin DATA and proceed with the AC tests. AC test conditions The reference signal level Pref for the following tests is defined as the minimum input level in dBm to give a BER 3 x 10-2 (e.g. 7.5 bit errors per second for 250 bits/s).
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
Table 1 Test signals FREQUENCY (MHz) 433.92 434.02 433.92 DATA SIGNAL 250 bits/s (square wave) - - MODULATION RZ signal with duty cycle of 66% for logic 1; RZ signal with duty cycle of 33% for logic 0 no modulation no modulation
UAA3201T
TEST SIGNAL 1 2 3 Test results
MODULATION INDEX 100% - -
P1 is the maximum available power from signal generator 1 at the input of the test board; P2 is the maximum available power from signal generator 2 at the input of the test board. Table 2 Test results GENERATOR TEST 1 Maximum input power; see Fig.4 Receiver turn-on time; see Fig.4 and note 1 Interception point (mixer); see Fig.5 and note 2 Interception point (mixer plus IF amplifier); see Fig.5 and note 3 Spurious radiation; see Fig.6 and note 4 1 dB compression point (mixer); see Fig.7 and note 5 Notes 1. The supply voltage VCC of the test circuit alternates between `on' (100 ms) and `off' (100 ms); see Fig.3. 2. Differential probe of spectrum analyser connected to pins MOP and MON. 3. Probe of spectrum analyser connected to pin LIN. 4. Spectrum analyser connected to the input of the test board. 5. Probe of spectrum analyser connected to either pin MOP or pin MON. test signal 1; P1 = -30 dBm (minimum Pmax) test signal 1; P1 = Pref + 10 dB test signal 3; P1 = -50 dBm test signal 3; P1 = -50 dBm - test signal 3; P11 = -70 dBm; P12 = -38 dBm (minimum P1dB) - 2 BER 3 x 10-2 (e.g. 7.5 bit errors per second for 250 bits/s) check that the first 10 bits are correct; error counting is started 10 ms after VCC is switched on RESULT
-
test IP3 = P1 + 12 x IM3 (dB); signal 2; minimum value: IP3mix -20 dBm P2 = P1 test IP3 = P1 + 12 x IM3 (dB); signal 2; minimum value: IP3IF -38 dBm P2 = P1 - - no spurious radiation (25 MHz to 1 GHz) with level higher than -60 dBm (maximum Pspur) (Po1 + 70 dB) - [Po2 + 38 dB (minimum P1dB)] 1 dB, where Po1 is the output power for test signal with P11 and Po2 is the output power for test signal with P12
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
MED899 - 1
VCC (V) 3.5 0 0 100 200 300 t (ms)
Fig.3 Timing diagram for pulsed supply voltage.
GENERATOR 1 50 TEST CIRCUIT (1) BER TEST FACILITY (2)
MED900
(1) For test circuit see Fig.9. (2) For BER test facility see Fig.8.
Fig.4 Test configuration (single generator).
GENERATOR 1 50
50 2-SIGNAL POWER COMBINER GENERATOR 2 50
TEST CIRCUIT
(1)
SPECTRUM ANALYZER WITH PROBE
IM3
f
f f = 100 kHz
f
MED901
(1) For test circuit see Fig.9.
Fig.5 Test configuration (interception point).
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
SPECTRUM ANALYZER INPUT IMPEDANCE 50
TEST CIRCUIT (1)
MED902
(1) For test circuit see Fig.9.
Fig.6 Test configuration (spurious radiation).
GENERATOR 1 50 TEST CIRCUIT
(1)
SPECTRUM ANALYZER WITH PROBE
MED903
(1) For test circuit see Fig.9.
Fig.7 Test configuration (1 dB compression point).
SIGNAL GENERATOR
TX data
MASTER CLOCK
BIT PATTERN GENERATOR
DEVICE UNDER TEST
delayed TX data
PRESET DELAY
RX data
INTEGRATE AND DUMP
DATA COMPARATOR BER TEST BOARD
MED904
to error counter
Fig.8 BER test facility.
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
APPLICATION INFORMATION
UAA3201T
handbook, full pagewidth
RF_IN C9 C11 C10 C5 L1 C6 C4 C15
C8 C20
+3.5 V data
C12
C17
R1
L2 FA 16
L3 VEM 15
C19
MIXIN 14
LIN 13 LIMITER
LFB 12
CPC 11 BUFFER
CPO 10
DATA 9
IF AMP
MIXER BUFFER
COMPARATOR
VCC Vref 1 MON C7 2 MOP
BAND GAP REFERENCE 3 VCC L4
UAA3201T
OSCILLATOR
4 OSC C18 C16
5 OSE
6 VEE
7 CPB
8 CPA
MED896
R2
(1)
C21
C14
C13
3.5 V
C1
C2
C3 SAWR
R3
(1) Stray inductance.
Fig.9 Application and test circuit.
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
Components and layout of printed circuit board of test circuit for fi(RF) = 433.92 MHz Table 3 Components list for Fig.9 VALUE 27 k 680 220 4.7 F 150 pF 1 nF 820 pF 3.3 pF 2.5 to 6 pF 56 pF 150 pF 220 pF 27 pF 150 pF 100 nF 2.2 nF 33 nF 150 pF 3.9 pF 10 nF 3.3 pF 68 pF 6.8 pF 47 pF 10 nH 330 H 330 H 33 nH - SAWR data DESCRIPTION Type Centre frequency Maximum insertion loss Typical loaded Q Temperature drift Turnover temperature 433.42 MHz 75 kHz 1.5 dB 1600 (50 load) 0.032 ppm/K2 43 C SPECIFICATION one-port (e.g. RFM R02112) TOLERANCE 2% 2% 2% 20% 10% 10% 10% 10% - 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 5% 10% 10% 10% 10% - TC = +50 ppm/K TC = +50 ppm/K TC = +50 ppm/K - TC = 0 30 ppm/K; tan 10 x 10-4; f = 1 MHz TC = 0 30 ppm/K; tan 10 x 10-4; f = 1 MHz TC = 0 30 ppm/K; tan 10 x 10-4; f = 1 MHz DESCRIPTION
UAA3201T
COMPONENT R1 R2 R3 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 L1 L2 L3 L4 SAWR Table 4
TC = 0 150 ppm/K; tan 30 x 10-4; f = 1 MHz TC = 0 300 ppm/K; tan 20 x 10-4; f = 1 MHz TC = 0 30 ppm/K; tan 10 x 10-4; f = 1 MHz TC = 0 30 ppm/K; tan 10 x 10-4; f = 1 MHz TC = 0 30 ppm/K; tan 10 x 10-4; f = 1 MHz TC = 0 30 ppm/K; tan 20 x 10-4; f = 1 MHz TC = 0 30 ppm/K; tan 10 x 10-4; f = 1 MHz tan 25 x 10-3; f = 1 kHz tan 25 x 10-3; f = 1 kHz tan 25 x 10-3; f = 1 kHz TC = 0 30 ppm/K; tan 10 x 10-4; f = 1 MHz TC = 0 150 ppm/K; tan 30 x 10-4; f = 1 MHz tan 25 x 10-3; f = 1 kHz TC = 0 150 ppm/K; tan 30 x 10-4; f = 1 MHz TC = 0 30 ppm/K; tan 10 x 10-4; f = 1 MHz TC = 0 150 ppm/K; tan 30 x 10-4; f = 1 MHz TC = 0 30 ppm/K; tan 10 x 10-4; f = 1 MHz Qmin = 50 to 450 MHz; TC = 25 to 125 ppm/K Qmin = 45 to 800 kHz; Cstray 1 pF Qmin = 45 to 800 kHz; Cstray 1 pF Qmin = 45 to 450 MHz; TC = 25 to 125 ppm/K see Table 4
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
MBE589
RF_IN
data
n.c.
UAA3201T
H4ACS15
Fig.10 Layout top side.
MBE591
PCALH/H4ACS15 51SCA4H
Fig.11 Layout bottom side.
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
MBE590
RF_IN
C5 L3 C4 L1 C15 DATA data
L2
R1 C19 C6 C12 C17 IC1
C13 C14 n.c. supply SAWR
UAA3201T
H4ACS15
Fig.12 Top side with components. Fig.12 Top side with components.
MBE592
C11 C10 C9 C21 C2 R2 C18 L4 C16 R3 C7 C1 C3 C8 C20
PCALH/H4ACS15 51SCA4H
Fig.13 Bottom side with components.
2000 Apr 18
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 3.9 mm
UAA3201T
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp 1 e bp 8 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
UAA3201T
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
Suitability of surface mount IC packages for wave and reflow soldering methods
UAA3201T
SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable
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Philips Semiconductors
Product specification
UHF/VHF remote control receiver
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1)
UAA3201T
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 69
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
03/pp20
Date of release: 2000
Apr 18
Document order number:
9397 750 06929

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